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Milestone

2019

11
Order received for Dry Etcher 10.5G large-area equipment (CSOT)
10
Completion of merger with subsidiary, Invenia V Co., Ltd
09
Full-scale order for Dry Etcher 8.6G large-area equipment (HKC, Myeongyang)
Order received for Dry Etcher 10.5G ICP equipment localization national project (Ministry of Trade, Industry and Energy)
07
ISO9001:2015 Quality Management System certification
03
Appointment of new CEO, Goo Dong-beom

2018

07
Appointed President "Dong-Beum Koo"
04
Established 2nd factory in Paju (INVENIA Q)
03
Appointed new CEO "Ho-Young Jung"

2017

12
Received an export award from the Korean Trade Association in recognition of shipping $100 Million worth of goods on the 52nd Trade Day
11
Awarded the Grand Prize of Work&Balance excellent company in the 2017 Kyung-gi Regional Competitiveness Award
10
Certified as an excellent company for invention (Korean Intellectual Property Office)

2016

12
Appointed as Excellent Workplace Innovation Company in 2016 (Ministry of Employment and Labor)
10
Received the 7th Display Day Dongtang Industrial Medal (Ministry of Trade, Industry and Energy)
03
Received the first domestic order for Dry Etcher 10.5G large-area equipment (BOE)
02
Changed corporate name to INVENIA Co., Ltd.
Expanded global markets of Dry Etcher (HKC)

2015

12
Merged with subsidiary "ADP System Co., Ltd."
03
Appointed CEO "Dong-Chan Shin"
Changed corporate name to LIG INVENIA Co., Ltd.

2014

12
Received an export award from the Korean Trade Association in recognition of shipping $70 Million worth of goods on the 51st Trade Day
07
Certified as an INNO-BIZ enterprise by Innovative Technology Association of Small/Medium sized companies
02
Established corporate offices in Beijing, China (AID FI Trading Co., Ltd.)
011
Successfully commercialized Flexible OLED In-Line bagging equipment for smartwatches

2013

12
Expanded global markets of Dry Etcher (CSOT)
07
Acquired patent of "Substrate bonding apparatus"
05
Cha-Joon Koo became the single largest shareholder
Contracted with LG for manufacturing equipments for 8G WOLED panels

2012

11
Acquired patent of "Panel bonding apparatus for bonding touch panel and display panel"
01
Established subsidiary "ADP System Co., Ltd."

2011

12
Received an export award from the Korean Trade Association in recognition of shipping $ 30 Million worth of goods on the 48th Trade Day
Dry Etcher selected as the next-generation world-class product by the Korean Ministry of Knowledge and Economy
11월
Successfully commercialized medium-sized Direct Bonder In-Line vacuum bonding equipment for smartpads

2010

07
Built an extension to the headquarters building
03
Changed corporate name to LIG ADP Co., Ltd.
02
Penetrated international markets for Dry Etcher (BOE Technology)
01
Penetrated international markets for Dry Etcher (AU Optronics)

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