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Semiconductor

Atmosphere Plasma Equipment

Entering PCB substrate cleaning applications with high-power plasma control expertise

High-power atmospheric plasma technology enables precise surface treatment of PCB substrates, adjusting wettability, adhesion and polishing characteristics while reducing organic surface impurities.

Atmospheric plasma equipment CAD drawing

Atmospheric Plasma Equipment

  • Organic contaminant cleaning and improved adhesion at atmospheric pressure
  • Stage Moving Type
  • Alignment Accuracy : ≤ 0.5mm
  • Wet Contact Angle: ≤ 5° (Initial C/A ≤ 30°, Bare Glass)

Customized Solutions

INVENIA offers flexible process and design support tailored to each customer’s product characteristics and applications.
Drawing on expertise validated through customer technical evaluations, we support the core performance required in mass-production environments, providing tailored consulting to improve process efficiency and reliability.

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